Production Cycle/Lead Time |
3 weeks standard for Multilayer; 2 weeks standard for Single and/or Double-Sided |
3 day, 7 days, and 2 weeks ** |
PCB Construction Technology |
Single sided, Double-Sided, Multi-Layer |
Up to 24 layer, Blind Via Buried Via, sequencial build |
Panel Size |
18 x 24” |
24 x 76”> * |
Panel Thickness |
.031 – .062” |
.005“ – .030, .063 – .400” * |
Substrate Materials |
FR4 and/or 185HR glass-filled woven |
FR406, FR408, GR, GY, GP, GX, GT, GI glass-filled woven, CEM1, CEM3, Specialty/High Frequency, Roger4003, Polyimide, ceramic filled Teflon, Duroid, N9320-13RF (Neltec), Metal-backed Aluminum, Brass: High Tg Materials include 185HR, IS410; 370HR and NP170 (atavistic) available only upon request* |
Copper Weight (base, ounce/sq.in.) |
0.50, 1, 2, and 3 oz. |
4 oz. base; 5.0+ ounce/sq.in. finished * |
Drilled Hole Size (min.) |
.010″ drill (.005~.006″ finished plated) |
< .010″ * |
Mechanical Tolerance |
+/-.010” positional |
+/-.005” positional |
Feature Resolution |
.006″ traces , .006″ space (“gap”) |
<.004“ traces , <.004” space (“gap”) |
Imagable panel area |
17 x 23″ |
>17.5 x 23.5″* |
Front-to-Back Registration |
+/-.003″ |
+/-.0015″ |
Soldermask (resist) |
All boards SMOBC LPI (Green, Red, Blue and Clear) |
LPI (any color), Wet (Green. Black, other); Peelable / strippable solder mask; Plugged/capped via; |
Soldermask to land clearance |
.004″ (LPI) ; .008″(screenable wet epoxy) |
<.004″(LPI) ; <.008″(screenable wet epoxy) * |
Soldermask dam (LPI) |
.008″ |
.004″ (LPI) * |
Etched feature : artwork deviation |
+/-.0007″ (1/2 oz. copper) ; .002″ (1.0 oz. copper) |
Please call for specifications on copper weights over 1.0 ounce/sq.in. * |
Plated-thru hole aspect ratio |
5:1 |
12:1 * |
Copper Plating Thickness |
.001″ nominal |
> .001″ * |
Final Metalic Finishes |
Tin-Lead HASL (Hot Air Solder Level), LEAD-FREE HASL, White Tin |
Immersion Silver Electrolytic NI Conductive Carbon ink “Hard” Gold (Electrolytic) ENIG (Electroless Nickel/Immersion Gold) Soft Bondable Gold |
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